JHDPCB Manufacturing Capacity

Category Capability Details
Board Size Min(pcs) 1*0.5mm
Max (Pnl Size) 250*1200mm
Base Material Thickness 0.06——0.3mm
Board Thickness 0.1-0.5mm
Base Copper Thickness 1/3OZ——2OZ
PTH Hole Wall Copper Thickness 8-20μm
Blind Hole Filling Capacity Aspect Ratio (Hole Size: Hole Depth) 01:10:00
Blind Hole Filling Capacity (Hole Size) 50-150μm
Single Line Impedance Tolerance ±10%
Differential Impedance Tolerance ±10%
Min Track/Spacing (Double Layers Board) Surface Copper Thickness:8-14μm 40/40 um
Surface Copper Thickness:15-20μm 45/45 um
Surface Copper Thickness:21-30μm 55/55 um
Surface Copper Thickness:31-40μm 75/75 um
Surface Copper Thickness:≥40μm 80/80 um
Line Width Tolerance Line Width≤0.050mm ±.02mm
0.05mm<Line Width≤0.15mm ±20%
Line Width>0.150mm ±10%
Silkscreen Silkscreen Character Min Width/Spacing 4mil
Impedance Green Solder Mask Thickness Range 10~30 μm
Related Capacity Dimension Tolerance from Line Edge to Plate Edge ±0.25 mm
Category Capability Details
Width Tolerance of White Line Smooth Place ±0.10 mm
Bump Place ±0.20 mm
Min Drilling Hole Size Machine Dril 0.100 mm
Min Punching Hole Size N/A 0.50 mm
Complete Hole Size Tolerances PTH ±0.050 mm
NPTH ±0.025 mm
Category Capability Details
Nickel Gold Plating Nickel Thickness 40~ 314U”
Nickel Th ±78U”
Gold Thickness 1.18U” ~ 40U”
Min Spacing (Golden Finger or Pad) 35um
Nickel Gold Immersion Nickel Thickness 40 ~ 236 U”
Nickel Th ±40U”
Gold Thickness 1U” ~ 3 U”
Min Spacing (Golden Finger or Pad) 40um
OSP OSP Thicknes 6U”~20U”